Heat shrinkable envelope
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United States of America Patent
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Jul 19, 1994
Issued Date -
N/A
app pub date -
Aug 28, 1992
filing date -
Mar 8, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A heat-shrinkable envelope is composed of at least one shrinkable planar layer on which a reinforcing component of fiber-shaped or thread-shaped reinforcing elements is arranged. These reinforcing elements are arranged in unregulated configuration, for example in the form of a fleece, felt or in an irregular fill. Advantageously, a cover layer may be applied so as to sandwich and bond the reinforcing component between the cover layer and the planar layer.
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