Printed circuit board assembling system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5329690
SERIAL NO

07987085

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of supplying parts in a system for assembling a printed circuit board by mounting the parts on a substrate at corresponding predetermined positions thereof. One or more kinds of substrates and at least one group of parts, to be mounted on the corresponding substrates, are introduced into the system lot by lot. The introduced parts on one or more previously prepared parts containers are placed so as to correspond to the substrates on which the individual parts are to be mounted, thereby providing one or more sets of the parts, each set corresponding to a respective one of the substrates. The sets of parts are supplied to a parts mounting station of the system.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDJAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Kazuo Yamato, JP 221 2440
Kobayashi, Mamoru Hadano, JP 48 849
Kojima, Akio Hadano, JP 106 1967
Ninomiya, Sigeru Tokyo, JP 2 140
Sasaki, Hideaki Hadano, JP 103 1405
Tsuji, Yoshihisa Hadano, JP 15 205
Yokoyama, Tetsuhiro Hadano, JP 2 55

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