High performance integrated circuit chip package
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United States of America Patent
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-
Jun 28, 1994
Issued Date -
N/A
app pub date -
Jan 7, 1992
filing date -
Nov 10, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high performance integrated circuit chip package includes a support substrate having conductors extending from one face to the opposite face thereof and a multilayer wiring substrate on the opposite face of the support substrate for connecting chips mounted thereon to one another and to the conductors. A heat sink includes microchannels at one face thereof, with thermally conductive cushions connecting the one face of the heat sink with the exposed back sides of the chips, to provide a high density chip package with high heat dissipation. The support substrate and heat sink may be formed of blocks of material having thermal expansion matching silicon. The cushions are a low melting point solder, preferably pure indium, and are sufficiently thick to absorb thermal stresses, but sufficiently thin to efficiently conduct heat from the chips to the heat sink.
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