Double-sided printed wiring board and method of manufacture thereof
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United States of America Patent
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-
Jun 7, 1994
Grant Date -
N/A
app pub date -
Dec 15, 1992
filing date -
Dec 15, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A double-sided printed wiring board includes a base plate having a copper foil laminated on each of the opposite sides thereof. The copper foil-laminated base plate has through-holes extending therethrough, and at least one of the through-holes is internally plated for providing a through-via-hole into which a resin filler is provided and solidified. A closed through-via-hole is thus obtained. The copper foil-laminated base plate including the closed through-via-hole is copper-plated, and a particular wiring pattern is formed thereon. A chip land is formed in alignment with the closed through-via-hole.
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