Method for the treatment of steel-hybrid printed circuit boards
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United States of America Patent
Stats
-
May 31, 1994
Grant Date -
N/A
app pub date -
Jan 9, 1992
filing date -
Jan 9, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of pre-treating steel-hybrid circuit board substrates or carrier plates before the application of coatings that are to be burnt in or fired. In prior art steel-hybrid circuit boards of this type, the burning-in of the coatings in a kiln produces undesirable warping of the circuit boards due to the different coefficients of thermal expansion of the materials employed for the coatings and for the carrier plates, unless relatively thick steel-hybrid circuit board carrier plates are employed. This warping is avoided, while still permitting the use of steel hybrid circuit boards of a lesser thickness, by pre-treating the steel-hybrid circuit board carrier plates to provide same with a mechanical pre-stress causing a defined curvature which compensates for the warping of the circuit board to be expected during burn-in.
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