Vertical boat used for heat treatment of semiconductor wafer and vertical heat treatment apparatus
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United States of America Patent
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May 31, 1994
Grant Date -
N/A
app pub date -
Dec 16, 1992
filing date -
Dec 16, 1991
priority date (Note) -
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Abstract
A semiconductor wafer boat used in a vertical CVD apparatus includes four columns fixed to upper and lower support plates. Each of the columns has a plurality of first grooves arranged at regular intervals in the vertical direction so as to place wafers in substantially parallel to each other, and a plurality of second grooves formed alternately with the first grooves. A plate ring is provided for each of the second grooves so as to improve the uniformity of thickness of a film to be formed on each wafer. Each ring has an outer diameter larger than that of a wafer, and an inner diameter smaller than that of the wafer. Each ring is placed such that there is a clearance for transferring each wafer between each ring and each wafer in the vertical direction.
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