Alignment check pattern for multi-level interconnection
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United States of America Patent
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May 3, 1994
Grant Date -
N/A
app pub date -
Oct 1, 1992
filing date -
Oct 1, 1991
priority date (Note) -
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Abstract
An alignment check pattern formed by a first insulating film; a first dummy pattern formed on a surface of said first insulating film; a second insulating film formed on a composite surface of said first insulating film and said first dummy pattern; a second dummy pattern formed on said second film, and positioned directly over said first dummy pattern in plan view; a third insulating film formed on a composite surface of said second insulating film and said second dummy pattern; a regular scale pattern formed on said third insulating film, and positioned directly over said second dummy pattern; fourth insulating film formed on a composite surface of said third insulating film and said regular scale pattern; and a vernier scale pattern formed on a surface of said fourth insulating film and positioned directly over said regular scale pattern.
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