Method for severing integrated-circuit connection paths by a phase-plate-adjusted laser beam
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 5, 1994
Grant Date -
N/A
app pub date -
Oct 22, 1991
filing date -
Oct 22, 1991
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for severing integrated-circuit conductive links by laser power employs a phase plate (26) to shape the laser beam's intensity profile. The profile thus imparted to the beam approximates the Fourier transform of the intensity profile desired on the workpiece (34). As a consequence, when a focusing lens (32) receives a beam having the profile imparted by the phase plate (26), it focuses that beam into a spot on the workpiece (34) having an intensity profile more desirable than the ordinary Gaussian laser-beam profile.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully