Importance

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Abstract

Electronic circuit node structures which minimize parasitic capacitance in linear path and angular circuit topographies for high frequency circuits are described. The electronic circuit comprises at least two signal conductor elements and an active or passive circuit element on a substrate. The conductor elements are arranged to define a gap between their ends. The circuit element bridges the gap. In one embodiment, the longitudinal axes of the conductor elements are laterally offset and generally parallel. The conductors are arranged to form the gap between adjacent edges on the ends of the conductors. The circuit element is arranged to bridge the gap. The other conductor edges near the gap are arranged at angles which increase the distance between them. In another embodiment, the conductor elements form an angle with the gap at the apex. The circuit element bridges the gap between the conductor edges nearest the apex. Other conductor edges are arranged to form a line parallel to the axis of the circuit element. The angle defined by the intersection of the conductor elements may be between 90 and 150 degrees. In all embodiments, the circuit element and/or the conductor elements may be thin-film superconductors. In all embodiments, the circuit element may be placed on the same side of the substrate as the conductor elements, or it may be on the opposite side of the substrate, overlapping the conductor edges forming the gap.

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First Claim