Thin film flexible interconnect for infrared detectors
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United States of America Patent
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Mar 1, 1994
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app pub date -
Dec 8, 1992
filing date -
Jun 28, 1991
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Abstract
An improved interconnect structure for electrically connecting an infrared detector to external circuitry wherein thin film metal conductors are deposited on a thin, insulating tape. One end of the structure terminates at the detector at about 77.degree. Kelvin, the other end terminating at external electronics at about 300.degree. Kelvin. Due to the small cross section of the conductor, heat leak to the detector is minimized. In addition, the carrier film is only 15 microns thick, thus minimizing outgassing material. The use of epoxies is eliminated. The structure can be fabricated in a variety of configurations using standard semiconductor equipment.
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