Thermoplastic low-profile additives and use thereof in unsaturated polyester resin compositions
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United States of America Patent
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Mar 1, 1994
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Jul 23, 1990
filing date -
Jul 23, 1990
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Abstract
A low-profile additive composition is disclosed which comprises ethylene glycol, at least one nonpolar diol, adipic acid and trimellitic anhydride. The low-profile additive, when included in an unsaturated polyester resin systems, for use in making sheet molding compositions, provides improved processing characteristics such as viscosity thickening plateau, paste viscosity and phase separation during maturation when the unsaturated polyester.
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