Heat-sensitive recording medium
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United States of America Patent
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Feb 15, 1994
Issued Date -
N/A
app pub date -
Sep 28, 1992
filing date -
Jan 23, 1991
priority date (Note) -
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Abstract
The present invention relates to a heat-sensitive recording medium which is excellent in dot-reproducibility and in adhesion between a support and a heat-sensitive recording layer provided thereon. The present recording medium comprises a synthetic-resin support, an ionomer-resin layer on the support, and a heat-sensitive recording layer provided on the ionomer-resin layer.
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