No-clean, low-residue, volatile organic compound free soldering flux and method of use
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United States of America Patent
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Jan 25, 1994
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N/A
app pub date -
Feb 5, 1993
filing date -
Feb 5, 1993
priority date (Note) -
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Abstract
A no-clean, low-residue, rosin-free soldering flux is described which comprises a solvent consisting essentially of demineralized water present in amount of at least about 95% by weight based on total weight of the soldering flux; from about 1% to about 4% by weight based on total weight of the soldering flux of a fluxing agent consisting essentially of at least two carboxylic acids selected from the group consisting of C.sub.2 -C.sub.10 dicarboxylic acids, monocarboxylic acids and hydroxy acids, said fluxing agent being present as solute in said deionized water solvent; and nonionic surfactant present in an amount of less than about 1% by weight based on total weight of soldering flux.
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