Methods of joining components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 4, 1994
Grant Date -
N/A
app pub date -
Oct 21, 1992
filing date -
Nov 4, 1991
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This method enables two components (1, 3) to be joined by soldering using heat generated by a laser beam, without the use of flux. A layer (5) of a material which has a lower melting point than the material of one of the components (3) is formed on that component and forms a bond therewith on resolidifying after melting. Solder (7) is interposed between the layer (5) and the other component (1) to form, on resolidification after melting, bonds with the material of the layer (5) and the other component (1). A coating (11) of a further material between the layer (5) and the solder (7) is dispersed when the adjacent layer material becomes molten and is not wetted by the solder (7) when molten. On applying heat to a region (15) of the layer using a laser beam, the layer is melted in this region (15) as is the adjacent solder (7) to form, on resolidification of the solder (7) and molten layer material (15 ), bonds between the solder (7) and the two components (1, 3).
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully