Controlled composite deposition method
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United States of America Patent
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Nov 30, 1993
Grant Date -
N/A
app pub date -
Nov 5, 1992
filing date -
Nov 27, 1991
priority date (Note) -
Expired
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Abstract
A composite deposit in which insoluble particles are co-deposited and dispersed in a metal matrix is formed on an article by dipping the article in a metal plating solution having insoluble particles dispersed therein and effecting an electroplating or chemical plating process. By adjusting the specific surface area of insoluble particles to be dispersed in the metal plating solution, the amount of insoluble particles co-deposited in the composite deposit can be controlled. Better results are obtained with insoluble particles having a specific surface area of 10 m.sup.2 /g or less.
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