Method of making a thin-film transducer ink jet head
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United States of America Patent
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Nov 30, 1993
Grant Date -
N/A
app pub date -
Nov 20, 1990
filing date -
Nov 20, 1990
priority date (Note) -
Expired
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Abstract
A thin-film transducer ink jet head is prepared by oxidizing one surface of a silicon wafer to provide a dielectric layer, forming electrodes on the layer by photoresist processing techniques, depositing one or more layers of PZT material to provide a thin-film piezoelectric layer having a thickness in the range of 1-25 microns, forming another pattern of electrodes on the surface of the PZT layer by photoresist techniques, and selectively etching the silicon substrate in the region of the electrodes to provide an ink chamber. Thereafter, an orifice plate is affixed to the substrate to enclose the ink chambers and provide an ink orifice for each of the chambers. An ink jet head having chambers 3.34 mm long by 0.17 mm wide by 0.15 mm deep and orifices spaced by 0.305 mm is provided.
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