Root canal filling material and adhesive composition
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United States of America Patent
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Nov 23, 1993
Issued Date -
N/A
app pub date -
Apr 23, 1993
filing date -
Oct 11, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
A composition for endodontically treating a root canal is provided. The composition uses a thermoset resin based material adapted for insertion into the root canal of a dental patient and an adhesive material suitable for maintaining the polymer based material in the root canal. Either one or both of the thermoset resin based material and the adhesive material is conductive. As a result, the dental practitioner is able to determine where the apex of the root canal is located by means of measuring the conductance between the thermoset resin based material and the oral mucosa and periodontal ligament. This facilitates the filling of the root canal with the polymer based material.
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