Apparatus for positioning integrated circuit packages for tinning
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United States of America Patent
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Nov 23, 1993
Grant Date -
N/A
app pub date -
Aug 6, 1992
filing date -
Aug 6, 1992
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A fixture for positioning high density packaged integrated circuits for tinning which includes a clamp bar assembly pivotally attached to a base. The base includes recessed nests in which the high density packages are positioned. The high density packages are secured in the nests by the clamp bar assembly. The top surfaces of the high density packages are protected from the solder wave by the base. A predetermined spacing and orientation of the nests ensures proper tinning.
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