Reversible heat-sensitive recording material

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United States of America Patent

PATENT NO 5262376
SERIAL NO

07990510

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Abstract

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A reversible heat-sensitive recording material comprising a polymer resin matrix material and organic low molecular weight compounds dispersed in the matrix material, wherein as the low molecular weight compounds, (A) at least one of higher ketones having at least 15 carbon atoms and (B) at least one of aliphatic saturated dicarboxylic acids having at least 12 carbon atoms, are used in combination at a weight ratio of (A) to (B) within a range of from 98:2 to 30:70.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI PLASTICS INDUSTRIES LIMITEDTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Higashi, Hiroshi Nagahama, JP 6 102

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