Heat-sensitive stencil paper
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United States of America Patent
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Nov 16, 1993
Grant Date -
N/A
app pub date -
Dec 6, 1991
filing date -
Mar 14, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermosensitive stencil paper contains a main component layer formed of a thermoplastic film and an ink-permeable support bonded together with adhesive, in which the ink-permeable support is a porous thin paper containing polynosic fibers as the main fibrous component. Optionally, the thermosensitive stencil paper has a plastic film layer whose surface is coated with a mold release layer containing as a main component a silicone oil having a kinematic viscosity of 500,000 cs or more. The transfer operation of the stencil paper in an automatic printer is excellent and its ink feeding performance during printing is high because of the polynosic fiber-containing porous thin paper support. Nonprinted spot defects are reduced because of the small number of bundled fibers in the stencil paper. Stencil paper containing the mold release layer are free of offsetting when rolled and cause no sticking for a long period of time, thereby providing thermosensitive stencil paper with excellent performance.
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