Solvent-free floorcovering adhesive and method of producing same
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United States of America Patent
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Nov 2, 1993
Grant Date -
N/A
app pub date -
May 23, 1991
filing date -
May 23, 1991
priority date (Note) -
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Abstract
A solvent-free adhesive formulation and a method for producing the adhesive is disclosed, the method involving dissolving resin in a heated oil and adding a surfactant thereto for dispersion purposes. Water is added to the resultant mixture to form an emulsion. A caustic agent is added to stabilize the emulsion and latex and thickener are added to the emulsion at ambient temperature. A stable, solvent-free adhesive is produced having superior bond strength and aging characteristics.
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