Apparatus for interlayer planarization of semiconductor material
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United States of America Patent
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Nov 2, 1993
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N/A
app pub date -
Jan 31, 1992
filing date -
Mar 22, 1990
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Abstract
A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad.
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