Method of and apparatus for manufacturing printed circuit boards
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United States of America Patent
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-
Oct 26, 1993
Issued Date -
N/A
app pub date -
Nov 13, 1989
filing date -
Nov 13, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is disclosed a dual purpose separator-release plate (30) for the use in the lamination and drilling of printed circuit boards, comprising a substrate sheet of aluminum foil (32), covered on both sides with release material (34), the plates being placed in engagement with the foil surfaces (6) and (8) of a PC board prior to curing the epoxy layer (4), after curing, retaining the separator-release plates in engagement with the PC board, and which plates serve as drill entry and drill backup material.
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