System for removing material from semiconductor wafers using a contained plasma
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United States of America Patent
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Oct 19, 1993
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N/A
app pub date -
May 7, 1991
filing date -
May 7, 1991
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Abstract
A system for thinning wafers includes thickness measuring apparatus that provides information to a computer for generating a memory map of the wafer surface. The memory map is used to control a material removal apparatus that thins the wafer to a uniform thickness.
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