System and method for applying a liquid
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United States of America Patent
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Oct 12, 1993
Grant Date -
N/A
app pub date -
Sep 12, 1991
filing date -
Sep 14, 1990
priority date (Note) -
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Abstract
A liquid applying system according to the present invention comprises a liquid supply source and a nozzle communicating with the liquid supply source. The nozzle comprises a liquid storing portion for storing a liquid supplied from the liquid supply source, a number of small passages communicating with the liquid storing portion, each of the small passages having a transverse section which is smaller than that of the liquid storing portion, and a slit-like passage communicating with the small passages, in which liquids from the small passages flow together and from which the liquids are continuously discharged like a curtain toward a semiconductor wafer.
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