Chemically cured low temperature polyimides
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United States of America Patent
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Sep 28, 1993
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N/A
app pub date -
Jan 25, 1991
filing date -
Jan 25, 1991
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Expired
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Abstract
The invention comprises curing polyamic acid solutions into polyimide solutions by adding a hydrophilic reagent to a polyamic acid solution. The hydrophilic reagent is selected to have little or no reactivity with amines or carboxylic acids, and is of the type that will react with water to form by-products that shift the equilibrium between polyamic acid as a reactant and polyimide and water as products toward the production of polyimide.
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