Resistive metal layers and method for making same
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United States of America Patent
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Sep 7, 1993
Issued Date -
N/A
app pub date -
Aug 26, 1991
filing date -
Feb 26, 1988
priority date (Note) -
Expired
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Abstract
Electrodeposited planar resistive layers are disclosed, which may be combined with conductive layers and insulative layers to produce laminates useful in the preparation of printed circuit boards. The resistive layers are prepared by electroplating from an electroplating bath containing a source of a normally conductive metal component and a source of a non-metallic resistance increasing additive. Planar resistors may be produced which have sheet resistances in the range of from about 15 to about 1000 .OMEGA. per square.
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