Microwave plasma processing apparatus

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United States of America Patent

PATENT NO 5243259
SERIAL NO

07798901

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a microwave plasma processing apparatus for processing such as thin film formation, etching, sputtering, and plasma oxidation, etc., on a surface of a processing object by utilizing a high density plasma generated by electron cyclotron resonance. A vacuum vessel of the apparatus, in which a microwave transmitted by a microwave guide is utilized for converting gas supplied to the vacuum vessel to plasma for the plasma processing of the processing object placed in the vacuum vessel, is formed in, such manner that the interior space of the vacuum vessel extends beyond the outer periphery of magnetic field generating coils, and the extended portion of the vessel is provided with a gas outlet for connection with an evacuation apparatus to evacuate the interior of the vacuum vessel to a desired vacuum degree. Accordingly, preferable evacuating characteristics can be obtained even in a case when a large amount of the reaction gas is supplied to the vacuum vessel in order to process a large size processing object, because the vacuum vessel in which the processing object is placed can be connected with the evacuation apparatus through a space and the same effect as if the evacuation apparatus is directly connected with the vacuum vessel is realized.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDTOKYO TOKYO METROPOLIS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Takuya Hitachi, JP 83 1052
Hirose, Shunichi Hitachi, JP 3 26
Sato, Junji Hitachi, JP 166 1453
Suzuki, Kazuo Hitachi, JP 249 2242
Todoroki, Satoru Yokohama, JP 5 111

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