Printed wiring board and process for producing the same
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United States of America Patent
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Sep 7, 1993
Grant Date -
N/A
app pub date -
Jul 25, 1991
filing date -
Aug 3, 1990
priority date (Note) -
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Abstract
A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.
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