Plated-through interconnect solder thief
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United States of America Patent
Stats
-
Sep 7, 1993
Issued Date -
N/A
app pub date -
Jan 19, 1993
filing date -
Dec 23, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A plated-through hole solder thief for inhibiting solder bridges between adjacent leads of an integrated circuit and simultaneously providing for electrical interconnection of certain leads of the integrated circuit other surfaces or layers of a printed wiring board. Plated-through holes are used as solder thieves and are located in the proximity of the last solder pad in a row of solder pads. The plated-through hole draws the solder from the last solder pad to fill the plated-through hole and inhibit bridging between functional leads of the integrated circuit as well as make an electrical interconnection between the last lead of the integrated circuit in each row and other surfaces or layers of the printed wiring board. The plated-through hole is located askew from the rows of solder pads so that functional use may be made of the plated-through hole once it is filled to provide a test point for testing the integrated circuit.
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