Modular unit for insertion into HF-tight housings for electronic equipment
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United States of America Patent
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-
Aug 3, 1993
Grant Date -
N/A
app pub date -
Apr 1, 1992
filing date -
Apr 4, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
For the purpose of high-frequency sealing the longitudinal gaps between the U-shaped profiles of the front plates of modular units that are to be inserted into HF-tight housings of electronic equipment, a spring element of metal, for example a non-corrosive steel, is proposed. This spring element is composed of two identical contact springs having spring leaves and a spring clip disposed therebetween. The spring clip is provided with a clamping leaf equipped with claws. A planar rear leaf connects the two contact springs with the spring clip. An angled-away insertion strip at the clamping leaf facilitates insertion of the spring clip onto a longitudinally rectangular longitudinal web at the rear face of the front plate. The spring leaves are provided with contact humps and an abutment strip and contact the longitudinal strip of the front plate of the adjacent modular unit which is provided with an insertion slope.
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