Metallized polymeric substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 3, 1993
Issued Date -
N/A
app pub date -
May 8, 1990
filing date -
May 8, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for metallizing a polymeric substrate is disclosed. The method includes contacting a surface of an etched polymeric substrate with a silane coupling agent and depositing a metallic layer over the surface. The silane coupling agent forms a chemical linkage between the substrate and the metallic layer. A coupling agent composition and a metallized polymeric substrate are also described.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully