Method of soldering in a controlled-convection surface-mount reflow furnace
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United States of America Patent
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Aug 3, 1993
Grant Date -
N/A
app pub date -
Mar 29, 1991
filing date -
Mar 29, 1991
priority date (Note) -
Expired
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Abstract
A reflow furnace in which the rate at which the temperature of the parts being processed can change can be varied throughout the furnace in order to provide a high initial rise rate, a period of low or no rise, and a very fast rise to a temperature above the melting point of solder followed by a fast drop to a temperature below the melting point of the solder. The entire operation is performed in an atmosphere of air, inert gas, active gas, or combustible gas. In a stabilization zone and a reflow zone, the primary heating mode is forced, controlled convection that is perpendicular to surface of an assembly to be soldered.
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