Solid state memory modules and memory devices including such modules
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United States of America Patent
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Jul 20, 1993
Grant Date -
N/A
app pub date -
Dec 4, 1991
filing date -
Dec 5, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A memory module has, on an interconnection substrate, a plurality of semi-conductor memory chips each having the same elongated shape and having output connections located at the end thereof. It has at least two chips which are mutually stacked and which are crossed so that the outputs of one chip are available beyond the periphery of the chip which is located under it in the stack. Consequently, the outputs of each chip may easily be connected to the substrate by bonded flexible wires.
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