Tungsten metallization
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United States of America Patent
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Jul 13, 1993
Issued Date -
N/A
app pub date -
Apr 30, 1990
filing date -
Nov 10, 1986
priority date (Note) -
Expired
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Abstract
The adhesion of tungsten to an underlying dielectric layer is improved by the use of a thin glue layer of either TiN or Al.
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