Heat dissipating device
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United States of America Patent
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-
Jun 29, 1993
Grant Date -
N/A
app pub date -
Jun 17, 1991
filing date -
Jun 15, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Heat dissipating devices for electronic component semiconductor chips are provided in the form of channels or grooves which are either integrated in the underside of the semiconductor chip or are formed in an additional thin semiconductor chip which has larger dimensions than the component chip and which is disposed between the underside of the component chip and the mounting base for the component chip. The channels are filled with a meltable material which is subjected to a heat absorbing phase conversion at temperatures which are critical for semiconductor component operation. In this way, short-term heat peaks in particular, can be reliably dissipated. Preferably, the channels are formed by micromechanical etching techniques and are preferably filled to the desired degree by a spin coating process.
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