Single inline packaged solid state relay with high current density capability
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United States of America Patent
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Jun 15, 1993
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N/A
app pub date -
Mar 24, 1992
filing date -
Jul 22, 1991
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Abstract
An AC solid state relay in a single inline package (SIP) comprised of dual silicon controlled rectifiers (SCRs) with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy. And a DC solid state relay in a single inline package (SIP) comprised of an NPN power transistor with a supporting circuitry mounted directly on an alumina substrate with molecularly bonded copper metalization layers and heat spreader all coated in a thermally conductive epoxy.
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