Semiconductor integrated circuit device and method of fabricating same
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United States of America Patent
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Jun 15, 1993
Grant Date -
N/A
app pub date -
Mar 13, 1992
filing date -
Mar 14, 1991
priority date (Note) -
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status (Latency Note)
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Abstract
In a chip carrier wherein a semiconductor chip is face down bonded to a package substrate through solder bumps, then covered with a cap and sealed hermetically using a sealing solder, the back of the semiconductor chip being bonded closely to the underside of the cap using a solder for heat transfer, a solder preform serving as the said heat transfer solder is heat-melted and a portion of the thus melted solder is allowed to flow into the sealing portion to effect the hermetic seal of the chip. Furthermore, in order to improve the flowability of the solder preform during the melt flow thereof, a metallized layer for heat transfer formed under the heat transfer solder of the cap and a sealing metallized layer are partially connected with each other through a connecting metallized layer.
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