Improved pressure-holding chamber type injection molding process and apparatus for injection molding of products

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United States of America Patent

PATENT NO 5219512
SERIAL NO

07476504

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Abstract

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A system of injection molding by an injection machine with a mold includes conventional fundamental steps including a material plasticizing and metering step, a material injecting step and a material pressure-holding step, but with an additional feature in that nozzle passage is interrupted midway therealong from communication between the interior of a machine body and a mold cavity, after the injecting step but while the material pressure-holding step is being carried out. The material pressure-holding step is carried out first using the injection machine per se operated with a plunger to exert a first non-stepped external or internal pressure on the entire injected material but second using another mechanism for exerting a second non-stepped or stepped internal pressure on a forward portion of the injected material separated due to the nozzle passage interruption.

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Patent Owner(s)

Patent OwnerAddress
SEIKI CORPORATIONMINATO-KU TOKYO 105

International Classification(s)

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances199019911992199319941995199619971998199920000255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsutsumi, Shigeru Yonezawa, JP 13 220

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  • 12 Citation Count
  • B29C Class
  • 56.67 % this patent is cited more than
  • 32 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges132251063918462222101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0102030405060708090100110120130140150160170180190200210220230240

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