Phenol formaldehyde steam pressing of waferboard
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United States of America Patent
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Jun 8, 1993
Grant Date -
N/A
app pub date -
Feb 25, 1992
filing date -
Feb 25, 1992
priority date (Note) -
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Abstract
The present invention relates to a method of producing a waferboard by applying first a liquid phenol formaldehyde resin to the surface of the wafers then a powdered phenol formaldehyde resin followed by forming a layup and pressing at elevated temperature and pressure using steam pressing techniques to consolidate the layup into a board and set the phenol formaldehyde adhesive.
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