Importance

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Abstract

This invention provides an improved system for removably coupling a conductive heat sink to a chip housing. The heat sink is of the type having a plurality of pins arrayed in a grid pattern and extending perpendicularly from the top surface of a generally square base. The chip housing is of the type having opposite side walls each having latching projections. The heat sink is positioned in conductive thermal communication with an exposed portion of a computer chip or other device which is securely mounted to the housing. A flexible and resilient spring clip is adapted to fit within the passages defined by the spaces between the pins on the heat sink. The flexibility of the spring clip allows portions along opposing walls of the spring clip to be stretched and guided over the latching projections. The resiliency of the spring clip provides a spring bias sufficient to retain the heat sink in conductive thermal communication with the chip element under required working conditions. The resilient forces of the stretched spring clip are not so great as to prevent the quick and easy manual insertion and removal of the spring clip.

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First Claim