Transmission lines for wafer-scale integration and method for increasing signal transmission speeds
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 13, 1993
Issued Date -
N/A
app pub date -
Oct 16, 1991
filing date -
Jan 1, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for optimizing the signal transmission speed between a signal source and a signal receiver of a microelectronic circuit is disclosed. The method includes the step of providing a signal transmission path whose length provides a predetermined ratio between its resistance and characteristic impedance which will reproduce the transmitted signal at the receiving end upon the first signal transition. The length of this transmission path may be increased by using a nonhomogeneous line structure in which the characteristic impedance increases in the direction of the signal transmission. In one form of the invention, the signal transmission path is formed by interconnecting a plurality of micro-strip conductors disposed on different planes of a universally programmable silicon circuit board. Under the appropriate circumstances, a signal can travel through such a 'semi-lossy' transmission path at approximately the speed of light.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully