Method for bonding LLCCC-components using a leadframe
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United States of America Patent
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Mar 30, 1993
Grant Date -
N/A
app pub date -
Jun 15, 1992
filing date -
Jun 15, 1991
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for electrically bonding surface-mountable integrated circuits (LLCCC-components) onto a printed circuit board. A specially shaped flexible bonding element having a semicircular central portion is used to flexibly connect the LLCCC components to the circuit board so that stresses due to thermal expansion of the components are absorbed.
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