Bonding fired multilayer capacitors into a stack
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United States of America Patent
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-
Mar 16, 1993
Grant Date -
N/A
app pub date -
Feb 10, 1992
filing date -
Feb 10, 1992
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multiple capacitor assembly has a multiplicity of flat, prefired ceramic capacitor slabs each containing a plurality of spaced capacitor electrode plates. Each of the slabs has one side coated with an adhesive layer composed of a mixture of glass frit and a metal silicate. The coated slabs are superimposed on each other to form a stack. Upon firing the stack, the adhesive layers fuse and bond the slabs together. Electrically conductive terminal stripes are applied to sides of the stack to connect electrically with the electrode plates. Terminal leads are applied to the terminal stripes. A coating of glass frit paste is applied to the stack. Upon firing the stack, the terminal stripes bond to the sides of the stack; the terminal leads bond to the terminal stripes, and the glass coating fuses and forms a hermetically sealed encapsulation for the entire stack.
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