Dip soldering apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 9, 1993
Grant Date -
N/A
app pub date -
Oct 15, 1991
filing date -
Oct 15, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a dip soldering apparatus, a first scraper blade scrapes the surface of the solder bath before a pot is raised through the surface of the bath, and a second blade then scrapes the surface of solder in the pot when the pot has been lifted through the surface. The blades are swept around in a circle to facilitate operation of the device. A rotary station for feeding components to the soldering apparatus comprises a rotatable table carrying a plurality of pneumatically operated stations to index them sequentially through operating positions. The air supply lines, for pneumatic control and operation of each station, are discrete to the respective operating positions and so it is not necessary to provide a system of supply lines which rotate with the stations. An end of a supply line is sealed to a conduit in the table by a PTFE sealing member which has an inwardly directed, tapered lip. As air pressure in the line is increased (to operate the station) the lip is urged against the underside of the table.
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