Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers

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United States of America Patent

PATENT NO 5190637
SERIAL NO

07874116

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Abstract

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Complex metal structures are formed in microminiature dimensions utilizing multiple mask exposures which are capable of producing substantially arbitrary three-dimensional shapes. A first layer of a primary metal is electroplated onto an exposed plating base to fill a void in a photoresist, the photoresist is removed, and a sexcondary metal, which can constitute a sacrificial metal, is electroplated over the first layer and the plating base. The exposed surface of the deposited secondary metal is then machined down to a height which exposes the first metal which exposes a substantially flat, uniform surface extending across both the primary and secondary metals. The secondary metal facilitates machining of the primary and secondary metals because of the mechanical stability provided by the secondary metal to the primary metal. After the first layer of the primary and secondary metals have been machined, another photoresist layer can be applied over the primary and secondary metal, and a second layer of primary metal is electroplated. A further layer of secondary metal can be also electroplated, if desired. Tyhe process of machining and electroplating can be repated until the desired structure is formed. Secondary metal is removed by and etchant which does not etch the primary metal.

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Patent Owner(s)

Patent OwnerAddress
WISCONSIN ALUMNI RESEARCH FOUNDATION614 WALNUT STREET 13TH FLOOR MADISON WI 53726

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Guckel, Henry Madison, WI 28 2466

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