Method for welding at least one region of an overlay sheet to a receiving surface of a carrier layer
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United States of America Patent
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Feb 16, 1993
Grant Date -
N/A
app pub date -
May 29, 1991
filing date -
May 31, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for welding at least one region of an overlay sheet (16) to a receiving surface of a carrier layer (14) by means of high frequency energy. In the method, on the surface remote from the receiving surface of the carrier layer (14) a foil (12) of electrically conductive material is disposed. The overlay sheet (16) is placed at least on a part of the receiving surface of the carrier layer (14). A high frequency electrode (18, 20) is placed onto the overlay sheet (16) in the region to be welded to the carrier layer (14) and a ground electrode (22) is placed onto a region of the overlay sheet (16) not to be welded to the carrier layer (14) or onto a part of the receiving surface not covered by the overlay sheet (16), said ground electrode (22) having an area which is greater than that of the high frequency electrode (18, 20). The high frequency energy is then switched on while the high frequency electrode ( 18, 20) is held with pressure against the overlay sheet (16).
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