Structure for supporting a resonator using an ultrathin piezoelectric plate in a package
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United States of America Patent
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Feb 9, 1993
Grant Date -
N/A
app pub date -
Oct 9, 1991
filing date -
Feb 9, 1990
priority date (Note) -
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Abstract
In a piezoelectric resonator having an ultrathin vibratory portion formed by a cavity made in a piezoelectric block and a thick frame-like rib formed integrally with said vibratory portion and surrounding it, an excess adhesive receiving groove or the like is cut in one marginal portion of the frame-like rib between an adhesive coated region. The resonator is fixedly housed in a package by use of an adhesive coated on one marginal portion of the frame-like rib along the z-axis direction, or by means of elastic pawls without using the adhesive. In this case, one marginal portion of the frame-like rib on the opposite side from a pad deposited on one side of the piezoelectric resonator is bonded to the bottom of the package. With such a structure, it is possible to prevent the adhesive from flowing into the cavity to cause variations in the resonance frequency of the piezoelectric resonator, to reduce the scatter of the temperature-frequency characteristic of a piezoelectric device using the resonator housed in a package during mass production, and to increase the bond strength of wire bonding for electrical connection of the piezoelectric resonator incorporated in the package.
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