Mold for lead casting

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United States of America Patent

PATENT NO 5184664
SERIAL NO

07723076

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Abstract

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A mold for lead casting comprising a porous metal material which does not form an alloy with molten lead and which has a thermal conductivity of from 3-15 kcal/(m.multidot.hr.multidot..degree.C.) and having a percentage of pores having a radius larger than or equal to 40 microns being 7% or less of the total pore volume. The porous metal material has a permeability of at least 0.2 ml/sec.multidot.cm.sup.2 at a material thickness of 10 mm and ambient pressure of 0.02 kg/cm.sup.2. A casting mold enabling casting of a lead grid without using a lubricant due to the lubricity of the mold material itself is realized.

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Patent Owner(s)

Patent OwnerAddress
HONDA GIKEN KOGYO KABUSHIKI KAISHA1-1 MINAMI AOYAMA 2-CHOME MINATO-KU TOKYO 107-8556
YUASA BATTERY CO LTDKYOTO PREFECTURE JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hayashi, Yuji Takatsuki, JP 132 1384
Ito, Masahiro Takatsuki, JP 384 3615
Shibata, Hiroyoshi Himeji, JP 9 7
Yoshida, Hiroyoshi Himeji, JP 62 761

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