Structurally-embedded electronics assembly
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United States of America Patent
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Feb 2, 1993
Grant Date -
N/A
app pub date -
Apr 5, 1990
filing date -
Apr 5, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A structurally-embedded electronics assembly is disclosed and includes an outer skin member which is lightly loaded structurally, a primary load-carrying member positioned inboard from the outer skin member, a core member positioned between the primary load-carrying member and the outer skin member, an intermediate skin member positioned between the outer skin member and the core member and an electronics structure positioned between a predetermined two of the members or intermingled with a predetermined number of the members set forth above which are adjacent each other. In another embodiment, a thermally conductive baseplate member is positioned inboard from the primary load-carrying member. In another embodiment, a vibration damping member is positioned inboard from the primary load-carrying member.
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